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rCore-Q8280

High-Performance Multimedia AI SoM

rCore-Q8280

rCore-Q8280

  • Features
  • Product Details
  • Block Diagram
  • Interfaces
  • Hardware Spec
  • Documentations
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Radxa rCore-Q8280

Compact Module. Flagship Arm Performance

Radxa rCore-Q8280 module
  • 8cx Gen 3

  • Octa-core

  • 29+ TOPS

  • PCIe Gen3

  • 128-bit LPDDR4X

  • Display

  • USB 3.2(10Gbps)

  • 50 x 80 mm

Flagship Arm Performance

Powered by Qualcomm Snapdragon 8cx Gen 3 (SC8280XP), built on advanced 5nm process technology for high performance and efficiency

8-Core Kryo CPU

(up to 2.7 GHz), balanced performance and power efficiency

3.0 GHz4x Kryo Prime
2.4GHz4x Kryo Gold
5nmProcess

Adreno 690 GPU

2.7 TFLOPS

DirectX 12 and DirectML support

Qualcomm® AI Engine

Up to 29 + TOPS

Advanced Media & Display Engine

Smooth 4K video playback and flexible display connectivity, with support for up to 4K@120 via USB-C DisplayPort or DP/eDP

Media and display engine

Video Processing

  • Qualcomm Adreno VPU
  • Video decode: H.265 / H.264 / VP9, up to 4K@120
  • Video encode: H.265 / H.264, up to 4K@60

Display Output

  • Qualcomm Adreno 1199 DPU
  • 1x 4-lane MIPI DSI
  • 2x 4-lane DP / eDP
  • 2x USB-C with DP1.4 Alt Mode

Fast Memory & Flexible Storage

Fast LPDDR4X memory and flexible storage options keep everything smooth, responsive, and ready for more

Storage overview
  1. Up to 32GB 128-bit LPDDR4X

  2. microSD via SD 3.0

  3. UFS via UFS 3.1 Gear 4

  4. NVMe over PCIe

  5. 32MB SPI NOR Flash

Versatile Connectivity for More Possibilities

Designed with extensive high-speed interfaces and flexible peripheral support, enabling powerful expansion for displays, storage, cameras, audio, and industrial I/O applications.

Connectivity Interface

  • 1x PCIe Gen3 x9
  • 2x USB 3.2 Gen2 10 Gbps
  • 2x DisplayPort 1.4 via USB-C
  • 1x USB 2.0
  • I2C / I3C / SPI / UART

Display Interface

  • 2x 4-lane DP / eDP
  • 1x 4-lane MIPI DSI
  • 2x USB-C with DisplayPort v1.4

Audio Interface

  • SoundWire

Camera Interface

  • 1x 4-lane MIPI CSI

Compact & Reliable Package Design

A compact 50 mm x 80 mm form factor with 1580-Ball BGA package and rich GPIO / QUP control interfaces for custom product integration

50 mm x 80 mm package size diagram
1580-ball BGA Package

Wide-Temperature Support

0°C to 60°C

Multi-OS & AI Ecosystem

Supports Radxa OS, Windows, Ubuntu, Debian, fnOS, and more, with Qualcomm AI Hub available to accelerate
AI model deployment and application development.

support os

Through the Qualcomm® AI Hub, developers can access a library of pre-optimized AI models, simplifying
on-device AI deployment, maximizing hardware performance, and delivering an exceptional user experience.

Carrier Board Customization

We support custom carrier board development with solution evaluation, reference design, and technical guidance to help customers accelerate product integration

  1. app1

    Technical Support

  2. app1

    Professional R&D Team

  3. app1

    Solution Evaluation

  4. app1

    Industry Experience

Build More Products with One SoM

Build More Products with One SoM

Comprehensive Technical Documentation and
Active Community

  • Comprehensive Technical Documentation and Active Community!

    Comprehensive Technical Documentation and Active Community !

    Radxa provides comprehensive technical documentation, empowering users to fully utilize their products. At the same time, they actively maintain an engaged community, fostering communication and collaboration among users.

    Community

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