rCore-Q6490
- Features
- Product Details
- Block Diagram
- Interfaces
- Hardware Spec
- Documentations
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Product Details
Radxa rCore-Q6490 is a compact edge AI system-on-module powered by the Qualcomm® Dragonwing™ QCS6490 platform. It integrates an 8-core Kryo™ 670 CPU, Adreno™ 643 GPU, and Hexagon™ 770 AI Engine delivering 12 Dense TOPS, with support for up to 16GB LPDDR5, 4K video processing, five 4-lane MIPI CSI interfaces, and high-speed PCIe, UFS, and eMMC storage and expansion. Its compact 42 x 36 mm form factor is ideal for robotics, machine vision, smart terminals, and industrial IoT applications.
Block Diagram
Interfaces
Hardware Spec
SoC
Qualcomm® Dragonwing™ QCS6490
CPU
8-core Kryo™ 670 CPU
- 1x Kryo Gold Prime @ 2.7 GHz
- 3x Kryo Gold @ 2.4 GHz
- 4x Kryo Silver @ 1.9 GHz
- 6nm Process
GPU
Qualcomm® Adreno™ 643 GPU
- OpenGL ES 3.2
- OpenCL 2.0
- Vulkan 1.x
- DirectX 12
AI Performance
Qualcomm® Hexagon™ 770
- 12 Dense TOPS
- Dual HVX + Hexagon CP 2.0 + Hexagon Tensor Accelerator
Memory
LPDDR5
- Capacity: Up to 16GB
- Memory bus width: 32-bit (2 channel, 16-bit per channel)
Codec
Qualcomm® Adreno™ 633 VPU
- Video decode: 1× 4K60 / 2× 4K30 / 4× 1080p60 (H.264 / H.265 / VP9)
- Video encode: 1× 4K30 / 4× 1080p30 (H.264 / H.265)
- Video concurrency: 1080p60 decode and 1080p60 encode / 4K30 decode + 1080p30 encode
- HDR playback: Support for HDR10 and HDR10+
PCIe
1x PCIe Gen3 x2 for NVMe SSD
1x PCIe Gen3 x1 for Wireless
Storage
On-Module eMMC 5.1
microSD via SDIO 3.0
NVMe over PCIe
UFS via UFS 3.1
Display
Qualcomm® Adreno 1075 DPU
- 1x 4-lane eDP / DisplayPort
- 1x 4-lane MIPI DSI
Camera
Qualcomm® Spectra 570L ISP
- 5x 4-lane MIPI CSI
- Up to 64 MP at 30 fps ZSL
USB
1x USB 3.1 Gen 1 (5Gbps) with DisplayPort Alt Mode
1x USB 2.0
Audio
Qualcomm Low-Power Audio Subsystem (LPASS)
- SoundWire codec bus for external audio codec and smart amplifier
Other
QUP
- I2C / I3C / SPI / UART support
Operating System
Radxa OS
Ubuntu
Deepin
Yocto
···
Package
540-Ball BGA
Operating Temp
Commercial and Industrial Temperatures Available
Dimension
42 x 36 mm
Design Resources
Carrier Board
FAQs
Qualcomm QCS6490
Octa-Core
12 TOPS
PCIe Gen3
LPDDR5
4K60 Display
5x 4-lane MIPI CSI
42 x 36 mm
Powered by Qualcomm Dragonwing QCS6490
8-core Kryo™ CPU
(up to 2.7 GHz), balanced performance and power efficiency
1x Kryo Gold Prime
@ 2.7 GHz
3x Kryo Gold
@ 2.4 GHz
4x Kryo Silver
@ 1.9 GHz
6nm
Process
Adreno™ 643 GPU
Desktop-class graphics processing
Hexagon™ 770 AI Engine
Up to 12 TOPS AI computing power
Dual HVX + Tensor Accelerator for complex AI inference at low power
4K Video & Flexible Display
rCore-Q6490 supports 4K video decode, 4K video encode, HDR10/HDR10+ playback, 1× 4-lane eDP / DisplayPort and 1× 4-lane MIPI DSI for embedded display and HMI applications.
High-Definition
Video Processing
Dual High-
Definition Display
Supports up to 4K60 video decoding, 4K30 video encoding, compatible with HDR10/HDR10+,
and high-speed video capture (1080p@240fps or 720p@480fps)..
Multi-Camera Vision
With 5× 4-lane MIPI CSI and Qualcomm® Spectra™ 570L ISP, rCore-Q6490 provides rich camera input resources for robotics, machine vision, smart terminals, and edge AI systems.
Qualcomm® Spectra™ 570L ISP
- 5x 4-lane MIPI CSI
Fast Memory & Flexible Storage
Fast LPDDR5 memory and multiple storage options keep your system smooth, responsive, and ready for more.
LPDDR5, up to 16GB
microSD via SD 3.0
Onboard eMMC 5.1
UFS via UFS 3.1 Gear4 x2
32MB SPI NOR Flash
NVMe over PCIe
Rich Interfaces for More Possibilities
Connect cameras, displays, storage, wireless modules, audio devices, and more with flexible high-speed interfaces built for edge AI products.
Connectivity Interface
- 1x PCIe Gen3 x2 for NVMe SSD
- 1x PCIe Gen3 x1 for Wireless
- 1x USB-C (5Gbps) with DP1.4 Alt Mode
- 1x USB 2.0
- I2C / I3C / SPI / UART
Display Interface
- 1x 4-lane DP / eDP
- 1x 4-lane MIPI DSI
Audio Interface
- SoundWire
Camera Interface
- 5x 4-lane MIPI CSI
Compact BGA Design for Custom Integration
A compact 42 × 36 mm BGA SoM with rich GPIO and QUP interfaces, making it easy to integrate into custom carrier boards and embedded products.
Commercial&Industrial
Options Available
42mm × 36mm
540-Ball BGA Package
Longevity until July 2036
Robust Software Ecosystem, Flexible Multi-System Adaptation
The Qualcomm® QCS6490 platform offers long-term support, compatible with various operating systems including Linux (Yocto, Ubuntu, Deepin, Fedora, Armbian, Arch), and Windows 11 IoT Enterprise, meeting the needs of different application scenarios.
Through the Qualcomm® AI Hub, developers can access a library of pre-optimized AI models, simplifying on-
device AI deployment, maximizing hardware performance, and delivering an exceptional user experience.
Carrier Board Customization
Radxa helps customers build custom carrier boards around rCore-Q6490 with professional engineering expertise, proven industry experience, and responsive technical support.
Technical Support
Professional R&D Team
Solution Evaluation
Industry Experience
One SoM, More Products
Use one rCore-Q6490 SoM to build products for edge AI, robotics, machine vision, smart display, industrial control, and embedded systems
Comprehensive Technical Documentation and
Active Community
Comprehensive Technical Documentation and Active Community !
Radxa provides comprehensive technical documentation, empowering users to fully utilize their products. At the same time, they actively maintain an engaged community, fostering communication and collaboration among users.
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Radxa rCore-Q6490
Energy-Efficient Edge AI SoM
Radxa rCore-Q6490
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